Reliability Testing for Semiconductors and Microelectronics
Deben provides high-precision testing solutions tailored for the semiconductor and electronics industries.
Our in-situ stages are ideal for evaluating the mechanical integrity of thin films, solder joints, micro-bumps, and flexible electronics. By combining precise mechanical loading with rapid heating and cooling cycles, you can simulate operational stresses and analyse failure mechanisms—such as delamination and electromigration—under an electron microscope or X-ray CT system.
Solutions for Semiconductor Failure Analysis:
- Micro-scale mechanical testing: Ideal for delicate wire bonds and MEMS devices.
- Thermal cycle simulation: Fast, accurate temperature control to mimic active component environments.
- Non-destructive correlation: Pairs seamlessly with X-ray CT for sub-surface inspection.
Ensure the longevity and performance of your next-generation electronic components with Deben.
Products for testing Semiconductors
Tensile and compression testing stage with precision slides and symmetrical stainless-steel leadscrew and Temperature control of your sample from -20° C to +160°C.
Tensile and compression testing stage with precision slides and symmetrical stainless-steel leadscrew
X-Ray CT Tensile and Compression Stage with Peltier Heating and Cooling
Ultra Coolstage™ – SEM Peltier Heating and Cooling Stage



