Advanced Reliability Testing for Electronics and Assemblies

Deben provides cutting-edge in-situ mechanical testing solutions designed specifically to validate the structural integrity of electronics—ranging from printed circuit boards (PCBs) and connectors to battery assemblies and display panels.

Our advanced micro-tensile, compression, and bending stages integrate perfectly with SEM, X-ray CT, and optical microscopes. This allows engineers to witness real-time degradation—such as solder joint fatigue, copper trace delamination, and thermal-mechanical warping—under precisely controlled operational simulations.

Key Applications for Electronics:

Component fatigue testing: Analyse multi-point bending and thermal cycling behaviour.
Flexible and wearable electronics: Evaluate material performance under repetitive tensile strain.
Non-destructive failure analysis: Pair with X-ray CT to isolate subsurface defects dynamically.

Enhance your product lifespan and optimize electronic component reliability with Deben.